Title:
MANUFACTURING METHOD OF RUTHENIUM WIRING
Document Type and Number:
Japanese Patent JP2022032259
Kind Code:
A
Abstract:
To provide a manufacturing method of a ruthenium wiring which can obtain a ruthenium wiring with reduced surface roughness while maintaining a good etching rate.SOLUTION: A manufacturing method of a ruthenium wiring includes the steps of treating a metal surface containing ruthenium with a first chemical solution containing a compound having a functional group capable of coordinating to a ruthenium atom in its structure, and etching the metal surface containing ruthenium treated with the first chemical solution with a second chemical solution.SELECTED DRAWING: None
More Like This:
| JP4312145 | Board position correction device and board position correction method |
| JP2004154874 | POLISHING DEVICE AND POLISHING METHOD |
| JPH0274035 | WET ETCHING SYSTEM |
Inventors:
WADA YUKIHISA
KOGA SHINYA
TAKAHASHI KAZUHIRO
OKAWA NATSUMI
MORI DAIJIRO
KOGA SHINYA
TAKAHASHI KAZUHIRO
OKAWA NATSUMI
MORI DAIJIRO
Application Number:
JP2020135864A
Publication Date:
February 25, 2022
Filing Date:
August 11, 2020
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
H01L21/306; C23F1/00; C23F1/40
Attorney, Agent or Firm:
Sumio Tanai
Masahisa Matsumoto
Ryu Miyamoto
Masato Iida
Masahisa Matsumoto
Ryu Miyamoto
Masato Iida