METHOD OF FORMING SEMICONDUCTOR SUBSTRATES

Title:

METHOD OF FORMING SEMICONDUCTOR SUBSTRATES

Document Type and Number:

Japanese Patent JPS522274

Kind Code:

A

Abstract:

PURPOSE:In electrically treating semiconductor substrates, a uniformly formed coating of good quality is obtained by way of two-step formation consisting of a heavy current-density formation and a small current-density formation.

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Inventors:

KOUDAKA TAKAYUKI

Application Number:

JP7684675A

Publication Date:

January 08, 1977

Filing Date:

June 24, 1975

Export Citation:

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Assignee:

IWATSU ELECTRIC CO LTD

International Classes:

H01L21/3063; H01L21/306; H01L21/316; (IPC1-7): H01L21/306

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