Title:
METHOD OF MANUFACTURING ELECTRONIC/ELECTRICAL COMPONENT, EPOXY RESIN COMPOSITION FOR INJECTION MOLDING, AND ELECTRONIC/ELECTRICAL COMPONENT
Document Type and Number:
Japanese Patent JP2017228611
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic/electric component good in appearance and having high quality excellent, such as heat resistance, chemical resistance and mechanical characteristics and high credibility at good productivity and conveniently.SOLUTION: An electronic/electrical component is manufactured by a method which includes the steps of: semi-curing an epoxy resin composition by arranging an electronic/electrical component element 2 in a form block 1, injecting a liquid epoxy resin composition 3 containing (A) an epoxy resin, (B) a photo-cationic polymerization initiator and (C) a thermal cationic polymerization initiator into the form block 1, and irradiating with light while heating it, and completely curing the epoxy resin composition 3 by post-curing after opening the form block 1.SELECTED DRAWING: Figure 1
Inventors:
FUJIURA HIROSHI
Application Number:
JP2016122714A
Publication Date:
December 28, 2017
Filing Date:
June 21, 2016
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01L21/56; B29C45/14; C08G59/18; H01L23/29; H01L23/31
Domestic Patent References:
| JP2009013315A | 2009-01-22 | |||
| JP2009079015A | 2009-04-16 | |||
| JP2006249357A | 2006-09-21 | |||
| JP2014173063A | 2014-09-22 |
Foreign References:
| WO2013153988A1 | 2013-10-17 |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office