To provide a method of manufacturing a printed circuit board, capable of making a large current to flow between both surfaces by electrically connecting a surface side and a backside.
In the method of manufacturing the printed circuit board, a surface side circuit pattern 20 having a first protrusion 21 and a first fitting part 23 is formed and a backside circuit pattern 40 having a second protrusion 41 and a second fitting part 43 is formed. The first protrusion 21 and the second protrusion 41 are inserted into an insertion hole 31 of a prepreg 30a from different directions and are opposed to each other and the fitting parts 23 and 43 are made to be close to each other. The fitting parts 23 and 43 are made to be engaged in a liquid tight manner by pressurizing an anti-insulating layer side of the surface side circuit pattern 20 and an anti-insulating layer side of the backside circuit pattern 40 and the circuit patterns 20 and 40 and an insulating layer 30 are laminated in a state in which the protrusions 21 and 41 are in contact with each other. The first protrusion 21 and the second protrusion 41 are electrically connected.
KONDO KAZUNORI
SAWADA TAKEHIKO
ASAI TOMORO
HAYAKAWA TAKAHIRO
Katsuhiko Tateishi