Title:
半導体素子を製造する方法
Document Type and Number:
Japanese Patent JP4326609
Kind Code:
B2
Abstract:
A semiconductor component can be manufactured by providing a leadframe (12) with leads (13) and a flag (14) substantially coplanar with at least one of the leads (13) wherein the flag (14) has a hole (15). An electronic substrate (11) is adhered to the flag (14) wherein a perimeter of the electronic substrate (11) has bonding pads (21), wherein the bonding pads (21) face toward the flag (14), wherein the electronic substrate (11) covers the hole (15), and wherein the flag (14) is absent over the bonding pads (21). Next, the pads (21) are wire bonded to the leads (13), and then the electronic substrate (11) and the leadframe (12) are encapsulated with a packaging material (17) wherein the packaging material (17) has an opening (23) and is devoid of covering the hole (15) in the flag (14).
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Inventors:
Brian a web
Application Number:
JP23009598A
Publication Date:
September 09, 2009
Filing Date:
July 30, 1998
Export Citation:
Assignee:
Freescale Semiconductor, Inc.
International Classes:
H01L23/28; H01L23/50; H01L23/31; H01L23/495
Domestic Patent References:
| JP9119875A | ||||
| JP7038046A |
Attorney, Agent or Firm:
Mamoru Kuwagaki