Title:
MODULE AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2012028484
Kind Code:
A
Abstract:
To provide a module having excellent radiation performance and a manufacturing method of the same.
The module comprises a substrate, a semiconductor device 24a serving as a heat generator mounted on the substrate, a resin part 82 formed at least on a top face of the substrate, in which the heat generator 24a is embedded, a heat radiation film formed on a top face of the resin part 82, and a metal plate 81 inserted above the heat generator 24a between the resin part 82 and the heat radiation film. Consequently, though the module includes a component having a height higher than that of the semiconductor device 24a, the module can successfully radiate heat generated by the semiconductor device 24a.
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Inventors:
KIMURA JUNICHI
KITAGAWA MOTOYOSHI
KITAGAWA MOTOYOSHI
Application Number:
JP2010164560A
Publication Date:
February 09, 2012
Filing Date:
July 22, 2010
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
H01L23/34; H01L23/28; H05K7/20
Domestic Patent References:
| JP2010232471A | 2010-10-14 | |||
| JP2010212379A | 2010-09-24 | |||
| JPH06275741A | 1994-09-30 | |||
| JP2011171540A | 2011-09-01 | |||
| JP2011171539A | 2011-09-01 | |||
| JP2003249607A | 2003-09-05 | |||
| JP2004297054A | 2004-10-21 | |||
| JP2007067407A | 2007-03-15 | |||
| JP2009181970A | 2009-08-13 |
Attorney, Agent or Firm:
Hiroki Naito
Daisuke Nagano
Kentaro Fujii
Daisuke Nagano
Kentaro Fujii