Title:
MOLDING RESIN
Document Type and Number:
Japanese Patent JP2020084045
Kind Code:
A
Abstract:
To provide a molding resin for obtaining a resin molded material that does not easily crack.SOLUTION: Provided is a molding resin containing thermoplastic resin (A) other than styrene copolymerized material (B), and styrene copolymerized material (B), and in which (A) is at least one thermoplastic resin selected from the group consisting of polyester resin, polyamide resin, polyacetal resin, polyolefin resin, polycarbonate resin and acrylic resin, and (B) is a homopolymerized material of styrene compound, or a styrene copolymerized material of a styrene compound and at least one monomer selected from the group consisting of (meth)acrylonitrile, vinyl ether, vinyl group-containing carboxylic acid and acrylic ester.SELECTED DRAWING: None
Inventors:
WATANABE TAKASHI
Application Number:
JP2018220775A
Publication Date:
June 04, 2020
Filing Date:
November 26, 2018
Export Citation:
Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C08L25/04; C08L23/00; C08L33/04; C08L55/02; C08L59/00; C08L67/00; C08L69/00; C08L77/00