Title:
CARRIER FILM
Document Type and Number:
Japanese Patent JP2586344
Kind Code:
B2
Abstract:
PURPOSE: To reduce warps generated on a carrier film at the time of assembling the carrier film and a semiconductor chip.
CONSTITUTION: A carrier film 20 has a plurality of slits 28 which are formed in the vicinity of the outside of a mounting part for mounting a semiconductor bare chip 10. The bare chip 10 to be mounted is rectangular, and the slits 28 are formed at four points along the four sides of the rectangle to surround the mounting part. The slits 28 are formed by punching with a metal die etching, etc.
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Inventors:
HO KEIICHIRO
MATSUDA SHUICHI
MATSUDA SHUICHI
Application Number:
JP23742594A
Publication Date:
February 26, 1997
Filing Date:
September 30, 1994
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/60; H01L23/495; (IPC1-7): H01L21/60
Domestic Patent References:
| JP5326648A | ||||
| JP5275498A | ||||
| JP57868B2 |
Attorney, Agent or Firm:
Yosuke Goto (2 outside)
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