Title:
NAPHTHOL RESIN, METHOD FOR PRODUCING THE SAME, EPOXY RESIN, EPOXY RESIN COMPOSITION, AND CURED PRODUCT OF THE SAME
Document Type and Number:
Japanese Patent JP2005350523
Kind Code:
A
Abstract:
To provide an epoxy resin composition capable of giving excellent heat resistance and moisture resistance to a cured product thereof and having excellent fluidity.
An epoxy resin is obtained by subjecting a naphthol resin expressed by formula to glycidyl etherification. The obtained epoxy resin is used as a chief material for the epoxy resin composition which is used for a semiconductor sealing material, etc.
Inventors:
OSHIMI KATSUHIKO
AKATSUKA YASUMASA
SUNAGA TAKAO
AKATSUKA YASUMASA
SUNAGA TAKAO
Application Number:
JP2004170471A
Publication Date:
December 22, 2005
Filing Date:
June 08, 2004
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
C08G8/08; C08G59/24; (IPC1-7): C08G8/08; C08G59/24