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Title:
OPERATION OF MAGNETRON-TYPE SPUTTERING DEVICE
Document Type and Number:
Japanese Patent JPS5647564
Kind Code:
A
Abstract:

PURPOSE: To prevent the pollution of a sputtered film by using the same material for the target portion and target push portion of a target and applying a preliminary sputtering before the sputtering operation.

CONSTITUTION: The cathode 1 facing an anode is made into a magnetron type in which the cathode body 2 is provided with the magnet 3 and the overlying target 4, and the target consists of the target portion 5 in an erosion region and the target push portion 6 in the region other than the erosion region, both of which are made of the same material. Prior to the operation of sputtering, the magnet 3 is turned into nonoperative state and preliminary sputtering is applied. Thus, the whose surface of the target 3 is cleaned by sputter etching. Also, even by the subsequent sputtering, clean sputtered film can be obtained because the target portion and its push portion are made of the same material.


Inventors:
FUJIOKA TOSHIAKI
Application Number:
JP12266579A
Publication Date:
April 30, 1981
Filing Date:
September 26, 1979
Export Citation:
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Assignee:
ULVAC CORP
International Classes:
C23C14/34; C23C14/35; C23C14/36; H01J37/34; (IPC1-7): C23C15/00



 
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