【発明の名称】半導体チップ検査用プローブの製法

Japanese Patent JP3374890

B2

PROBLEM TO BE SOLVED: To reduce the size of an inspection probe and to eliminate crosstalk and mismatching of characteristic impedance, by forming a contact section that connects a contact point pad of a semiconductor chip and a test circuit provided next stage out of conductive springs each having a projection shape which are electrically insulated. SOLUTION: A plurality of contact sections 2 are provided to positions on a substrate 1 matched with a contact point pad P of a semiconductor chip O to be inspected. The contact sections 2 are formed of conductive springs each having a projection shape which are electrically insulated with each other and serve to conduct the semiconductor chip O to a test circuit in a rear stage. An object of the probe for inspecting the semiconductor chip is a part except the semiconductor chip O to be inspected and the electrode pad P. The semiconductor chip O can be inspected at the inspecting time when the electrode pad P and contact section 2 in the plate spring structure of the probe for inspecting the semiconductor chip are electrically brought into contact with each other. As a result, flexibility of the contact section 2 in the vertical direction can be achieved so that the contacting can be achieved by virtue of the elastic force even when a step S is existing.

JP2009008450	MANUFACTURING METHOD OF PROBE, AND MANUFACTURING METHOD OF PROBE CARD
JP5503898	Probe unit
JP2024502719	battery probe set

Takahiro Ito
Renji Sawada

JP23874596A

February 10, 2003

September 10, 1996

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Nippon Telegraph and Telephone Corporation

G01R1/073; H01L21/66; G01R31/26; (IPC1-7): G01R1/073; G01R31/26; H01L21/66

JP7209334A
JP1150862A
JP774216A
JP6267383A
JP63109658U

Takahiko Suga

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