PURPOSE: To enable easy correction of lead sections by forming a section exposed outside at least a package in an outer lead frame by a shape memory alloy.

CONSTITUTION: Outer lead sections 1 in a package for an electronic part with outer lead sections, particularly, an integrated circuit, are prepared by a shape memory alloy. Consequently, the external shapes of the leads 1 projected from a package body 3 are deteriorated in a package, external shapes of which are degraded due to an impact from the outside, but the leads 1, external shapes of which are deteriorated, are returned to an original shape when they are heated at a fixed temperature or more because a lead frame in the package is formed by the shape memory alloy. Accordingly, the shapes of the outer lead sections can be corrected easily.