Title:
感光撮像素子および関連方法
Document Type and Number:
Japanese Patent JP7386830
Kind Code:
B2
Abstract:
Photosensitive devices and associated methods are provided. In one aspect, for example, a photosensitive imager device can include a semiconductor substrate having multiple doped regions forming at least one junction, a textured region coupled to the semiconductor substrate and positioned to interact with electromagnetic radiation, and an electrical transfer element coupled to the semiconductor substrate and operable to transfer an electrical signal from the at least one junction. In one aspect, the textured region is operable to facilitate generation of an electrical signal from the detection of infrared electromagnetic radiation. In another aspect, interacting with electromagnetic radiation further includes increasing the semiconductor substrate's effective absorption wavelength as compared to a semiconductor substrate lacking a textured region.
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Inventors:
Haddad, Homayoun
Jiang, Jutao
McKee, Jeffrey
miller, drake
Forbes, Leonard
Parshur, Chintamani
Jiang, Jutao
McKee, Jeffrey
miller, drake
Forbes, Leonard
Parshur, Chintamani
Application Number:
JP2021134458A
Publication Date:
November 27, 2023
Filing Date:
August 20, 2021
Export Citation:
Assignee:
Sonics, LLC
International Classes:
H01L31/10; H01L27/144; H01L27/146
Domestic Patent References:
| JP2010226071A | ||||
| JP2007305675A | ||||
| JP2009503898A |
Foreign References:
| WO2010098224A1 |
Attorney, Agent or Firm:
Taro Yaguchi
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