Title:
PLANARIZATION TREATMENT METHOD AND WET ETCHING CONTROL APPARATUS
Document Type and Number:
Japanese Patent JP2002305170
Kind Code:
A
Abstract:
To provide a planarization treatment method and a wet etching control apparatus for realizing planarization level which is small in variation in film thickness with small polishing amount.
As shown in step 11, the planarization of a layer to be planarized by a chemical mechanical polishing. In step 12, specified regions, causing the unevenness of the planarization, is selected at a step after the chemical mechanical polishing. In step 13, a chemical liquid containing at least an etching liquid is jetted on the selected specified regions by an ink-jetting method to perform a wet etching control, thereby improving the planarization level.
More Like This:
Inventors:
ASAKAWA TSUTOMU
Application Number:
JP2001107948A
Publication Date:
October 18, 2002
Filing Date:
April 06, 2001
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H01L21/306; H01L21/304; (IPC1-7): H01L21/304; H01L21/306
Attorney, Agent or Firm:
Masanori Ueyanagi (1 outside)
Previous Patent: METHOD FOR PREPARING POLISHING SLURRY
Next Patent: METHOD AND APPARATUS FOR WORKING SEMICONDUCTOR WAFER
Next Patent: METHOD AND APPARATUS FOR WORKING SEMICONDUCTOR WAFER