Title:
PLASMA ETCHING DEVICE
Document Type and Number:
Japanese Patent JP2015037109
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a plasma etching device arranged so that the power consumption of decompressing means can be cut down.SOLUTION: A plasma etching device comprises: an electrostatic chuck table for holding a work piece; plasma-generation means for producing and ejecting plasma of a process gas; an etching chamber housing the electrostatic chuck table and the plasma-generation means in which the work piece is etched; decompressing means for decompressing the inside of the etching chamber; and control means. The decompressing means includes, in the order of being connected to the etching chamber, a turbo pump, a buffer tank, a dry pump, and a pressure gauge for measuring the pressure in the buffer tank. The control means controls the dry pump to stop working on condition that a value of the pressure gauge is below a critical pressure of the turbo pump, and controls the dry pump to work on condition that the value of the pressure gauge is raised to reach a value close to the critical pressure of the turbo pump, whereby the power consumption of the dry pump is cut down.
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Inventors:
ARAMI JUNICHI
WADA SATOSHI
WADA SATOSHI
Application Number:
JP2013167977A
Publication Date:
February 23, 2015
Filing Date:
August 13, 2013
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/3065
Domestic Patent References:
| JP2001338917A | 2001-12-07 | |||
| JP3108228U | 2005-04-14 |
Foreign References:
| WO2003071591A1 | 2003-08-28 |
Attorney, Agent or Firm:
Matsumoto 昂
Tomohiro Okamoto
Tomohiro Okamoto