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Title:
PLASMA PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2010238739
Kind Code:
A
Abstract:

To provide a plasma processing method capable of performing preheating before plasma processing in a short time when performing the plasma processing accompanied by heating of a workpiece.

When a wafer is arranged in a chamber and subjected to the plasma processing while heated, the wafer is preheated (preliminary heating) prior to the processing while irradiated with plasma, and a processing gas is supplied into the chamber after preheating to perform the plasma processing on the wafer.


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Inventors:
SANO MASAKI
TAKAHASHI TETSURO
MAEKAWA KOJI
KUBO ATSUSHI
YOSHIOKA TAKAHIRO
Application Number:
JP2009082286A
Publication Date:
October 21, 2010
Filing Date:
March 30, 2009
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
ELPIDA MEMORY INC
International Classes:
H01L21/318; H01L21/316
Attorney, Agent or Firm:
Hiroshi Takayama



 
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