Title:
POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2023074769
Kind Code:
A
Abstract:
To provide a polishing device that can eliminate the problem that a wafer is insufficiently divided due to the fact that processing using a laser beam is not executed properly, which damages a device chip.SOLUTION: A polishing device includes: a chuck table 52 having a rotatable holding surface; polishing means comprising a rotary shaft 32 that rotatably supports a polishing pad 35 that polishes a wafer W held on the holding surface of the chuck table 52; perpendicularly feeding means that processing-feeds the polishing means in a perpendicular direction relatively with respect to the holding surface of the chuck table 52; parallely feeding means that processing-feeds the polishing means in a parallel direction relatively with respect to the holding surface of the chuck table 52; and control means 100, which makes thickness measuring means 4 measure a thickness of the wafer W, generates mapping data concerning the thickness of the wafer W, determines that polishing is acceptable when variation in the thickness is in an allowable value, on the basis of the mapping data, and instructs re-polishing when the variation in the thickness is out of the allowable value.SELECTED DRAWING: Figure 2
More Like This:
| JP6269450 | A processing device of a work |
| JPH09193003 | POLISHING DEVICE |
| JP4238130 | Equipment and methods for measuring tool deterioration |
Inventors:
SEKIYA KAZUMA
NOMARU KEIJI
NOMARU KEIJI
Application Number:
JP2021187888A
Publication Date:
May 30, 2023
Filing Date:
November 18, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B37/005; B24B49/02; B24B37/10; B24B49/12; H01L21/304
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko