Title:
研磨パッド、研磨パッドの製造方法、及び光学材料又は半導体材料の表面を研磨する方法
Document Type and Number:
Japanese Patent JP7405500
Kind Code:
B2
Abstract:
To provide a polishing pad that can suppress defect in an object to be polished, attain flat topography and has excellent defect performance and topography performance.SOLUTION: The polishing pad has a polishing layer containing polyurethane resin. The polyurethane resin is a cured material of a curable resin composition containing an isocyanate terminal urethane prepolymer and a curative agent. The isocyanate terminal urethane prepolymer is a reaction product of polyol components containing polyoxyalkylene glycol with molecular weight of 50-300 and polyisocyanate components. Contents of the polyoxyalkylene glycol is more than 0 weight% and less than 5 weight% with respect to the whole of the isocyanate terminal urethane prepolymer.SELECTED DRAWING: None
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Inventors:
Tatsuma Matsuoka
Hiroshi Kurihara
Satsuki Narushima
Hiroshi Kurihara
Satsuki Narushima
Application Number:
JP2018068370A
Publication Date:
December 26, 2023
Filing Date:
March 30, 2018
Export Citation:
Assignee:
Fujibo Holdings Co., Ltd.
International Classes:
B24B37/24; C08G18/10; C08G18/32; C08G18/38; C08G18/48; C08G18/66; C08G18/76; C08J5/14; H01L21/304
Domestic Patent References:
| JP2004043768A | ||||
| JP2016196057A | ||||
| JP11322878A | ||||
| JP2008252017A | ||||
| JP2017185566A |
Foreign References:
| WO2016021317A1 |
Attorney, Agent or Firm:
Osamu Yamamoto
Toru Miyamae
Junichi Matsuo
Koichi Yokota
Toru Miyamae
Junichi Matsuo
Koichi Yokota