Title:
研磨パッド、その製造方法およびこれを用いる半導体素子の製造方法
Document Type and Number:
Japanese Patent JP7285613
Kind Code:
B2
Abstract:
The embodiments provide a polishing pad, a process for preparing the same, and a process for preparing a semiconductor device using the same. In the polishing pad according to an embodiment, the average value of the modulus of the pore region and that of the non-pore region is adjusted to 0.5 GPa to 1.6 GPa, whereby it is possible to achieve an excellent life span, to improve the scratches and surface defects appearing on the surface of a semiconductor substrate, and to further enhance the polishing rate.
Inventors:
Ho, Haeyoung
Yoon, Jong Wook
Kyon, Myeongok
Seo, Jangwon
Yoon, Jong Wook
Kyon, Myeongok
Seo, Jangwon
Application Number:
JP2020177593A
Publication Date:
June 02, 2023
Filing Date:
October 22, 2020
Export Citation:
Assignee:
SK enpulse Co.,Ltd.
International Classes:
B24B37/24; H01L21/304
Domestic Patent References:
| JP2019024078A | ||||
| JP2008168422A | ||||
| JP2006100556A | ||||
| JP2006257178A | ||||
| JP2009267367A |
Foreign References:
| WO2019188577A1 | ||||
| WO2018049204A1 |
Attorney, Agent or Firm:
SK Patent Attorney Corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito
Previous Patent: Adhesive film for heat-resistant protection
Next Patent: TAKING IN AND OUT DEVICE WITH FALLING PREVENTING DEVICE
Next Patent: TAKING IN AND OUT DEVICE WITH FALLING PREVENTING DEVICE