POLISHING PAD AND POLISHING METHOD - MATSUSHITA ELECTRIC IND CO LTD

Title:

POLISHING PAD AND POLISHING METHOD

Document Type and Number:

Japanese Patent JP2002103204

Kind Code:

A

Abstract:

To realize a predetermined surface roughness and no scratch and reduce a cost and working time by successively performing polishing processes from a rough polishing to a finish polishing in one process with one polishing device (surface plate), and realize selective polishing of only a desired region and a predetermined film thickness of an entire surface of a work regardless of initial film thickness variation of the work.

After an object 11 to be polished is polished to have the predetermined film thickness by a pad 1 for rough polishing arranged in an outer peripheral part on one surface plate A5, the object 11 is successively moved to a position of the pad 2 for finish polishing arranged at an inner peripheral part, thereby automatically changing a slurry and a polishing condition. Accordingly, polishing operations from the rough polishing to the finish polishing of the object can successively be performed in one process.

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Inventors:

OTSUKA KYO
ISHIMARU HIDEYUKI
MURAKAMI TOMOYASU

Application Number:

JP2000302239A

Publication Date:

April 09, 2002

Filing Date:

October 02, 2000

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD

International Classes:

B24B37/20; B24B37/22; H01L21/304; (IPC1-7): B24B37/00; H01L21/304

Attorney, Agent or Firm:

Murayama Mitsui

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