POSITIVE TYPE RADIATION SENSITIVE RESIN COMPOSITION

Japanese Patent JP2001330959

A

To provide a positive type radiation sensitive resin composition having high transparency to radiation, excellent in resolution, sensitivity, pattern shape, etc., causing no development defect in microfabrication and capable of producing a semiconductor device in a high yield.

The positive type radiation sensitive resin composition contains (A) an alkali-insoluble or slightly alkali-soluble acid dissociable group-containing resin having a structure of formula (1) [where R1 is H, a 1-5C linear or branched alkyl or a 1-5C linear or branched alkoxyl] and/or a structure of formula (2) [where Z is a 4-20C trivalent alicyclic hydrocarbon group or its substituted derivative and X is a single bond or a 1-5C divalent organic group] and convertible to an alkali-soluble resin when the acid dissociable group is dissociated and (B) a radiation sensitive acid generating agent.

JP5194135	A chemically amplified positive resist composition, a resist film using the same, a resist coating mask blank, and a resist pattern forming method.
JP2002287360	METHOD FOR DESIGNING PHOTOSENSITIVE COMPOSITION AND LITHOGRAPHIC METHOD
JP2000053601	NEW ONIUM SALT AND RADIO SENSITIVE RESIN COMPOSITION CONTAINING THE SAME

NISHIMURA YUKIO
DOUKI KATSUJI
KAJITA TORU
SHIMOKAWA TSUTOMU

JP2000151175A

November 30, 2001

May 23, 2000

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JSR CORP

G03F7/039; C08F8/12; C08F20/30; C08F32/00; C08K5/00; C08L33/14; C08L45/00; C08L101/08; H01L21/027; (IPC1-7): G03F7/039; C08F8/12; C08F20/30; C08F32/00; C08K5/00; C08L33/14; C08L45/00; C08L101/08; H01L21/027

Toshiaki Fukuzawa

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