To provide a printed wiring board for a driving circuit board of a liquid crystal cell, capable of minimizing thermal deformation such as warp to ensure reliability and stability over aging of an electrically connected portion in a signal path from the driving circuit board to the liquid crystal cell.

Mounting regions 12, 12 where electronic components are mounted, and at least two spare board regions 11, 11 where the electronic components are not mounted, are formed on the printed wiring board 10 for the driving circuit board of the liquid crystal cell 30. The respective spare board regions 11 are formed in the direction along the peripheral portion of the liquid crystal cell 30, and dummy patterns P1, P2 for canceling the warp and the deflection of the printed board 10 are formed on the respective spare board regions 11. Moreover, the spare board regions 11, 11 and the mounting regions 12, 12 are arranged such that two spare board regions 11, 11 sandwich the mounting regions 12, 12.