Title:
PRODUCTION OF SUBSTRATE HAVING CONDUCTIVE PATTERN
Document Type and Number:
Japanese Patent JP3507908
Kind Code:
B2
Abstract:
PURPOSE: To obtain such a resist pattern having excellent etching durability and having high resolution and to easily remove the resist film remaining after etching, by improving the resin component of a photopolymerizable compsn.
CONSTITUTION: A photopolymerizable compsn. containing vinyl polymer and photopolymn. initiator as the main component is applied on a substrate at least one surface of which has a conductive layer to form a film not hardened on the conductive layer. This vinyl polymer contains 0.3-7.5 equiv. polymerizable unsatd. group per one kg of the polymer and 0.1-2.5 equiv. non-proton onium salt-contg. group expressed by formula I. In formula I, R1 is a hydrogen atom or methyl group, R2 is a hydrogen atom or hydrocarbon group of 1-8 carbon number which may have substituents of hydroxyl groups, alkoxy groups, ester groups or halogen atoms,-W+ is expressed by formula II. Then the film not hardened is irradiated with active rays to selectively harden the coating film in an exposed part, washed with water to dissolve and remove the coating film in unexposed part to etch the conductive body, and then the resist film is removed.
Inventors:
Iwazawa, Naozumi
Isozaki, Osamu
Ogawa, Tetsuo
Isozaki, Osamu
Ogawa, Tetsuo
Application Number:
JP4510395A
Publication Date:
March 15, 2004
Filing Date:
February 10, 1995
Export Citation:
Assignee:
KANSAI PAINT CO LTD
International Classes:
G03F7/029; C08F2/48; G03F7/038; G03F7/42; H05K3/06; (IPC1-7): G03F7/038; G03F7/029; G03F7/42; H05K3/06
Attorney, Agent or Firm:
小田島 平吉 （外２名）