Title:
半径方向の偏った研磨パッド
Document Type and Number:
Japanese Patent JP5089073
Kind Code:
B2
Abstract:
A polishing layer (140) has an annular polishing track (125) concentric with rotational center (102). The radial micro-channels are formed in the polishing layer within width (133) of the annular polishing track and a majority of the micro channels have a radial orientation and an average width less than 50mu m. An independent claim is included for substrate polishing method.
Inventors:
Gregory Pee Muldowny
Application Number:
JP2006109276A
Publication Date:
December 05, 2012
Filing Date:
April 12, 2006
Export Citation:
Assignee:
Rohm and Haas Electronic Materials CMP Housings, Inc.
International Classes:
B24B37/20; B24D99/00; B24B37/26; B24B53/017; B24B53/02; H01L21/304
Domestic Patent References:
| JP9117855A | ||||
| JP2003303793A | ||||
| JP2004167605A | ||||
| JP2003145413A | ||||
| JP2002100592A | ||||
| JP2001001253A |
Foreign References:
| WO2005023487A1 | ||||
| WO2005030439A1 |
Attorney, Agent or Firm:
Hajime Tsukuni
Fumio Shinoda
Koshiro Tsukuda
Fumio Shinoda
Koshiro Tsukuda