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Patent Searching and Data


Title:
RADIATION-CURABLE AND HEAT-RELEASABLE SELF-ADHESIVE SHEET AND METHOD OF PRODUCING CUT FRAGMENT BY USING THE SAME
Document Type and Number:
Japanese Patent JP2001226650
Kind Code:
A
Abstract:

To obtain a radiation-curable and heat-releasable self-adhesive sheet having a self-adhesiveness durable to a transferring step such as the transfer or the like of an adherend, hardly causing a winding-up or chipping of the adhesive at the cutting step, and capable of facilitating the releasing and recovering of cut fragments after the cutting.

This radiation-curable and heat-releasable self-adhesive sheet has a self-adhesive layer comprising thermally expandable fine spheres and a radiation-curable compound, formed at least on one side of a substrate. An article to be cut is placed on the self-adhesive layer surface of the radiation- curable and heat-releasable self-adhesive sheet, and the self-adhesive layer is cured by irradiating the self-adhesive layer with radioactive rays. The article to be cut is cut to provide the cut fragments, and the cut fragments are released and recovered by heating the foaming the adhesive layer to efficiently produce the cut fragment without causing a bad condition.


Inventors:
KIUCHI KAZUYUKI
OSHIMA TOSHIYUKI
MURATA SHUTO
ARIMITSU YUKIO
Application Number:
JP2000038899A
Publication Date:
August 21, 2001
Filing Date:
February 16, 2000
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
H01L21/301; C09J7/22; C09J7/38; C09J11/00; C09J201/00; H01L21/68; (IPC1-7): C09J7/02; C09J11/00; C09J201/00; H01L21/301
Attorney, Agent or Firm:
Yukihisa Goto