Title:
SEAL MOLDING ACRYLIC RUBBER COMPOSITION
Document Type and Number:
Japanese Patent JP3791179
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain seal molding acrylic rubber compositions having a halogen- containing ethyl acrylate/n-butyl acrylate copolymer as the major component which are not only excellent in heat resistance and low temperature properties but also improved in abrasion resistance and durability.
SOLUTION: Desired seal molding acrylic rubber compositions comprise a halogen-containing ethyl acrylate/n-butyl acrylate copolymer having a copolymerization composition of about 60-85 wt.% ethyl acrylate and about 40-15 wt.% n-butyl acrylate; an oxide or hydroxide of an alkali metal or alkaline earth metal; carbon fibers; and a fatty acid metal soap/sulfur based vulcanizing agent.
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Inventors:
Hironori Nishishina
Application Number:
JP11335698A
Publication Date:
June 28, 2006
Filing Date:
April 23, 1998
Export Citation:
Assignee:
NOK CORPORATION
International Classes:
C08K13/04; C08L33/08; C08K3/06; C08K3/22; C08K5/098; C08K7/06; (IPC1-7): C08L33/08; C08K13/04; //(C08K13/04; C08K3:22; C08K7:06; C08K5:098; C08K3:06)
Domestic Patent References:
| JP7228746A | ||||
| JP11181209A | ||||
| JP45030579B1 | ||||
| JP7179752A |
Attorney, Agent or Firm:
Toshio Yoshida