Title:
Semiconductor device
Document Type and Number:
Japanese Patent JP6206359
Kind Code:
B2
Abstract:
A semiconductor device includes: a stacked unit including a semiconductor module and a plurality of coolers each having a flow passage through which a coolant flows, the semiconductor module being disposed between the coolers; a coolant supply-discharge pipe configured to supply the coolant to the coolers or discharge the coolant from the coolers, the coolant supply-discharge pipe being passed through the stacked unit in a stacking direction of the stacked unit; a displacement restricting member provided at a first end portion of the coolant supply-discharge pipe, the displacement restricting member being configured to restrict displacement of the stacked unit in the stacking direction of the stacked unit; and a pressurizing member provided at a second end portion of the coolant supply-discharge pipe, the pressurizing member being configured to apply force to the stacked unit in a direction toward the first end portion.
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Inventors:
Eisaku Kakiuchi
Yasuro Kinoshita
Yasuro Kinoshita
Application Number:
JP2014174271A
Publication Date:
October 04, 2017
Filing Date:
August 28, 2014
Export Citation:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
H01L23/40; H01L23/473; H05K7/20
Domestic Patent References:
| JP2009212137A |
Attorney, Agent or Firm:
Ken Ieiri