To obtain a semiconductor device in which a larger number of terminals can be arranged by providing a first terminal group arranged on a first plane, and a second terminal group arranged on a second plane disposed alternately to the first plane.

Protruding faces 12a and recessed faces 12b are formed at a predetermined pitch on the end face of a resin board 12. A first terminal group 13 is arranged on the protruding faces of the resin board 12 and a second terminal group 14 is arranged on the recessed faces 12b of the resin board 12. The first terminal group 13 is arranged on the bottom of the protruding face 12a of the resin board 12 and the second terminal group 14 is arranged on the recessed face 12b of the resin board 12. Since the first terminal group 13 and the second terminal group 14 are arranged on different planes and the first terminal group 13 is arranged on the bottom of the protruding lace 12a of the resin board 12, insulation can be kept perfectly between the first terminal group 13 and the second terminal group 14. According to the structure, the terminal pitch can be narrowed and a larger number of terminals can be arranged on a semiconductor device.