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Title:
Semiconductor memory device
Document Type and Number:
Japanese Patent JP6151504
Kind Code:
B2
Abstract:
A semiconductor device including a plurality of first diffusion layers that are formed over a semiconductor layer and disposed at predetermined intervals in a first direction, a plurality of second diffusion layers that are formed over the semiconductor layer, isolated from the first diffusion layers in a second direction orthogonal to the first direction, and disposed at the predetermined intervals in the first direction, a plurality of first regions that have a predetermined width in the first direction for separating the first diffusion layers from each other, a plurality of second regions that align with the first regions in the second direction and have the predetermined width for separating the second diffusion layers from each other, and a plurality of contacts that are formed over the first diffusion layers and over the second diffusion layers.

Inventors:
Hiroyuki Takahashi
Mochimaru Satoshi
Application Number:
JP2012229906A
Publication Date:
June 21, 2017
Filing Date:
October 17, 2012
Export Citation:
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Assignee:
Renesas Electronics Corporation
International Classes:
H01L21/8242; H01L27/108
Domestic Patent References:
JP8125034A
JP2012114274A
JP2004087074A
JP7135257A
Attorney, Agent or Firm:
Ken Ieiri