Title:
半導体モジュール
Document Type and Number:
Japanese Patent JP5601374
Kind Code:
B2
Abstract:
A semiconductor module (1,2,3,4) includes a semiconductor device (10); a metal plate portion (50, 501, 502) that includes a first surface (50c) on a side of the semiconductor device and has a fastening portion (52,521,522) at an end thereof; a molded portion (60) that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion (57, 573) that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins (57a, 573a) on a side opposite to the side of the metal plate portion; wherein the fastening portion (52,521,522) of the metal plate portion (50, 501, 502) is exposed out of the molded portion, and the cooling plate portion includes a fastening portion (58) at a position (57, 573) that corresponds to a position of the fastening portion of the metal plate portion.
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Inventors:
Doorway Takuya
Yoshikazu Suzuki
Masaya Kachi
Kiyofumi Nakajima
Tatsuya Miyoshi
Kawashima 崇功
Tomomi Okumura
Yoshikazu Suzuki
Masaya Kachi
Kiyofumi Nakajima
Tatsuya Miyoshi
Kawashima 崇功
Tomomi Okumura
Application Number:
JP2012531634A
Publication Date:
October 08, 2014
Filing Date:
September 02, 2010
Export Citation:
Assignee:
Toyota Motor Corp.
International Classes:
H01L23/36; H01L25/07; H01L25/18; H02M7/48; H05K7/20
Domestic Patent References:
| JP2009070934A | 2009-04-02 | |||
| JP2008186958A | 2008-08-14 | |||
| JP2008103502A | 2008-05-01 | |||
| JP2008124430A | 2008-05-29 | |||
| JP2007251076A | 2007-09-27 | |||
| JP2009070934A | 2009-04-02 | |||
| JP2008186958A | 2008-08-14 | |||
| JP2008103502A | 2008-05-01 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito