To develop a solder joint layer which is highly resistant against creep deformation.
The solder joint layer, which is a joint layer formed in joining members using a solder containing Sn, contains at least one selected from a group consisting of Pb, Cu, Ag, Bi and Zn in addition to Sn and Au, and the joint layer further has intermetallic compounds composed containing Sn and Au as a major component, the intermetallic compounds distributing at the ratio of 5 to 50% in area percentage of a joint cross-section. In addition, in the case when two or more members are joined, the solder joint layer is provided by forming the surface of at least one member to be composed of Au, placing a solder on the at least one member and heating the solder to have the Au solved into the solder. A joined member is provided with such a solder joint layer.
COPYRIGHT: (C)2007,JPO&INPIT
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SAKATA MASATO
ZAMA SATORU
MUGISHIMA TOSHIO
TSUZUKI HIDEKAZU
| JPH06204615A | 1994-07-22 | |||
| JPH07128550A | 1995-05-19 | |||
| JP2002001576A | 2002-01-08 | |||
| JPH0366492A | 1991-03-22 |