Title:
SPUTTERING METHOD AND DEVICE
Document Type and Number:
Japanese Patent JPH10212572
Kind Code:
A
Abstract:
To provide an excellent sputtering method in which the problems of the conventional technology can be minimized or solved.
In a method in which a substrate is coated by the sputtering from a target in a vacuum chamber by forming the plasma in a chamber 1 in the vicinity of a target 2, and charging the target, the surface of the target 2 on which the sputtering is performed comprises a plurality of regions of different composition, and separate electric connection is made to each region so that the changing charging is performed on the individual regions.
Inventors:
THWAITES MICHEL JOHN
Application Number:
JP30184297A
Publication Date:
August 11, 1998
Filing Date:
November 04, 1997
Export Citation:
Assignee:
BOC GROUP PLC
International Classes:
C23C14/34; C23C14/54; H01L21/203; (IPC1-7): C23C14/34; H01L21/203
Attorney, Agent or Firm:
Minoru Nakamura (6 outside)
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