To provide a substrate coating device capable of forming a coating film having uniform film thickness on the substrate, and a substrate coating method.

After a nozzle 21 is moved and positioned at a coating film formation position, a coating liquid 57 for liquid application from a supply source 56 is delivered to a nozzle delivery part 211 and a coating film formation block 51 is simultaneously moved in a longitudinal direction Y of the nozzle 21. Thereby, the coating film 58 is formed by the coating liquid 57 for liquid application delivered from fine nozzles 531, 541 over a whole area in the longitudinal direction Y at a tip end 211 of the nozzle 21. After the nozzle 21 is moved and positioned at a coating starting position, the nozzle 21 is descended and the coating film 58 formed at the delivery part 211 is brought into contact with a surface of the substrate P to form a reservoir. Subsequently, formation of the coating film is carried out by delivering the coating liquid from the nozzle delivery part 211 while the nozzle 21 is horizontally moved in a coating direction X.