Title:
基板加熱装置及び基板加熱方法
Document Type and Number:
Japanese Patent JP6789040
Kind Code:
B2
Abstract:
To shorten beat time required for temperature reduction of the heating portion. A substrate heating apparatus comprises a pressure reduction portion of performing pressure reduction of atmosphere within the accommodation space of the substrate coated with solution; a heating portion configured at one side of the substrate and capable of heating the substrate; an infrared ray heater configured at the other side of the substrate and capable of heating the substrate using the infrared ray; and a reflection surface configured between the heating portion and the infrared ray heater and reflecting the infrared ray toward the heating portion.
More Like This:
| JPH0689863 | FORMATION OF THIN FILM |
| WO/2006/129643 | PLASMA TREATMENT APPARATUS AND PLASMA TREATMENT METHOD |
Inventors:
Shigeru Kato
Tsutomu Sabota
Kenichi Yamatani
Yoshiaki Masu
Tsutomu Sabota
Kenichi Yamatani
Yoshiaki Masu
Application Number:
JP2016167693A
Publication Date:
November 25, 2020
Filing Date:
August 30, 2016
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
H01L21/31; F27B17/00; F27D3/00; F27D11/02; F27D17/00; H01L21/312; H05B3/00; H05B3/10
Domestic Patent References:
| JP2006210496A | ||||
| JP2015036590A | ||||
| JP2016105487A | ||||
| JP2015141965A |
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida