Title:
SUBSTRATE FOR LIQUID EJECTION RECORDING HEAD, MANUFACTURE THEREOF AND LIQUID EJECTION RECORDER
Document Type and Number:
Japanese Patent JP3618965
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate for a liquid ejection recording head and a manufacturing method thereof capable of achieving high density of the liquid ejection recording head, power consumption, high durability and high responsiveness and of improving recording quality.
SOLUTION: An electrode wiring layer 2 is formed on a substrate 1, a pattern of an intermediate insulation layer 3 is formed thereon, the intermediate insulation layer 3 is partially removed by patterning and a metallic material is buried therein to form a through-hole section 4. After the metallic film layer is provided to the recess section formed by partially removing the intermediate insulation layer 3 by the patterning, it is continuously heated without exposing to the air to precipitate a metallic monocrystal in the recess section to form an electrode wiring layer 5. After that, the intermediate insulation layer 3, through- hole section 4 and electrode wiring layer 5 are polished to be flattened by a CMP(chemical-mechanical polishing) method. A heating resister element layer 6 is formed on the flattened surface and protection layers 7, 8 are formed thereon, thereby forming the substrate for a liquid ejection recording head.
Inventors:
Tonogaki Masahiko
Teruo Ozaki
Toshihiro Mori
Yoshiyuki Naka
Teruo Ozaki
Toshihiro Mori
Yoshiyuki Naka
Application Number:
JP17904297A
Publication Date:
February 09, 2005
Filing Date:
June 19, 1997
Export Citation:
Assignee:
Canon Inc
International Classes:
B41J2/05; B41J2/16; (IPC1-7): B41J2/05; B41J2/16
Domestic Patent References:
| JP1070541U | ||||
| JP3281360A | ||||
| JP7290739A |
Attorney, Agent or Firm:
Yoshiro Sakamoto