TAPE HAVING SEMICONDUCTOR-ORIENTED BONDING AGENT, BOARD FOR CONNECTING SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR DEVICE

Japanese Patent JP3932999

B2

PROBLEM TO BE SOLVED: To provide a tape having a semiconductor-oriented bonding agent which excels in its punched quality and has high bonding quality, a board using the tape and for connecting semiconductor integrated circuits, and a semiconductor device.
SOLUTION: The tape having a semiconductor-oriented bonding agent which is so formed as to laminate a bonding-agent layer and a protecting-film layer on a flexible organic insulating film in this order satisfies following necessary conditions: (1) the bonding strength (A) of the bonding-agent layer and the protecting-film layer is 1-15 N/m, (2) the bonding strength (B) of the bonding-agent layer and the organic insulating film is not smaller than 15 N/m, (3) the ratio (B/A) of the bonding strength (B) to the bonding strength (A) is not smaller than 2.5, and (4) the Young's modulus of the bonding-agent layer is 20-120 MPa.

WO/1993/006184	PRESSURE SENSITIVE ADHESIVE COMPOSITION WHICH IS REPULPABLE UNDER ACIDIC pH CONDITIONS
WO/2018/124370	METHOD FOR PREPARING ADHESIVE TAPE FOR CONTROL OF ULTRAVIOLET CURABLE REACTION HEAT, AND ADHESIVE TAPE
JP2001230553	ADHESIVE FILM FOR MULTIL AYER PRINTED WIRING BOARD

Yukitsuna Konishi
Ryuichi Kamei
Shoji Kikoshi

JP2002198743A

June 20, 2007

July 08, 2002

Click for automatic bibliography generation  

TORAY INDUSTRIES,INC.

C09J7/02; H01L21/60; C09J161/00; C09J163/00; C09J177/00; C09J201/00; (IPC1-7): H01L21/60; C09J7/02; C09J161/00; C09J163/00; C09J177/00; C09J201/00

JP2000273415A

Previous Patent: PART DELIVERY PLANNING METHOD AND PART DELIVERY PLANNING DEVICE

Next Patent: PRINTING SYSTEM, PRINTER HOST, AND PROGRAM