Title:
脆性材料の熱応力割断方法
Document Type and Number:
Japanese Patent JP5345334
Kind Code:
B2
Abstract:
In a method for scribing fragile material, a laser beam is irradiated onto a work plate of the fragile material. The work plate is heated by absorption of the irradiated laser beam and generating thermal stress by the heating. The laser beam is formed by a plurality of laser beam groups arranged along a beam scanning direction on a same line, and the plurality of laser beam groups are divided into two groups. One takes charge of initial heating and rising up temperature of the work plate, and another takes charge of temperature holding of the work plate. The laser beam intensity corresponding to each of the laser beam groups is adjusted so as to obtain optimum values. By the method, it is possible to remarkably increase scribing speed of the work plate of the fragile materials without increasing heating temperature.
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Inventors:
Hiroshi Tamura
Application Number:
JP2008100887A
Publication Date:
November 20, 2013
Filing Date:
April 08, 2008
Export Citation:
Assignee:
Remi Co., Ltd.
International Classes:
C03B33/09; B23K26/00; B23K26/067; B23K26/38; B28D5/00; C03B33/033; G02F1/13
Domestic Patent References:
| JP3792639B2 | ||||
| JP10034364A | ||||
| JP7328781A | ||||
| JP2006525659A |