To provide a thermoelectric conversion module of low bond resistance including an n-type ZnO-based thermoelectric conversion element.

A thermoelectric conversion module 1 includes an n-type thermoelectric conversion element 2, a p-type thermoelectric conversion element 3, and a conductive member 4 for connecting the n-type thermoelectric conversion element and the p-type thermoelectric conversion element electrically. The n-type thermoelectric conversion element is a ZnO-based thermoelectric conversion element, and the conductive member includes at least silver solder. The ZnO-based thermoelectric conversion element and the silver solder have a directly bonded structure, and the total content of silver and copper occupies 98% or more of the silver solder, when the weight of silver solder is 100%.