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Title:
THIN FILM DEPOSITION DEVICE AND THIN FILM DEPOSITION METHOD
Document Type and Number:
Japanese Patent JP2023029419
Kind Code:
A
Abstract:
To provide a thin film deposition device and a thin film deposition method capable of depositing a thin film with a uniform thickness in width direction.SOLUTION: A thin film deposition device has: an optical monitor 31, 32 that measures optical properties of a thin film deposited on a base film in width direction; and a plurality of sputtering chambers SP1-SP10 including a supply part that has a plurality of gas nozzles in the width direction of the base film and supplies a reactive gas to around a target, and a sputtering electrode that applies voltage to a target, the plurality of sputtering chambers being disposed in the longitudinal direction of the base film. On the basis of the optical properties of the optical monitor 31, 32 in the width direction, a flow rate of a reactive gas jetted from each gas nozzle is controlled.SELECTED DRAWING: Figure 1

Inventors:
Takashi Ikegami
Takashi Kaneko
Tatsuya Arai
Hiroshi Suzuki
Application Number:
JP2022205053A
Publication Date:
March 03, 2023
Filing Date:
December 22, 2022
Export Citation:
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Assignee:
Dexerials Co., Ltd.
International Classes:
C23C14/34; C23C14/08; G02B1/113
Attorney, Agent or Firm:
Akira Koike
Takaaki Kono