PURPOSE: To provide a polyimide resin composed of a fluorine-containing aromatic diamine, an aromatic acid dianhydride containing no fluorine at the termini and a terminal allynagic acid anhydride, exhibiting a low dielectric constant, a low water absorption and a low refractive index, excellent in adhesion and heat resistance and suitable for a semiconductor device-protecting film, etc.

CONSTITUTION: As a fluorine-containing diamine component, 2,2-bis(4- aminophenyl)hexafluoropropane is dissolved in a solvent such as N-methyl-2- pyrrolidone and 2,2-bis(3,4-dicarboxyphenyl)hexa-fluoropropane dianhydride as a non-terminal fluorine-containing acid component is added to this solution in an atmosphere of dry nitrogen at room temperatures. After continuing the reaction between both the components for 12hr, an allynagic acid anhydride composed of ally-bicyclo(2,2,1)hept-5-ene-2,3-dicarboxylic acid anhydride as a terminal acid component represented by formula I is added and the resultant mixture is further reacted for 3hr, thus obtaining the objective polyimicle resin as a terminal allynagic acid represented by formula II (R1 is a group of formula III; R2 is a group of formula IV, etc.).