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Title:
【発明の名称】被覆用ポリアミド樹脂組成物
Document Type and Number:
Japanese Patent JP3134769
Kind Code:
B2
More Like This:
WO/2021/192479INSULATION FILM, METAL BASE PLATE AND METAL BASE PLATE PRODUCTION METHOD
JP5556416A polyimide board, a metal lamination polyimide board, and a printed wired board
Inventors:
Mitsuru Tokumoto
Yoshiro Iwata
Application Number:
JP10732696A
Publication Date:
February 13, 2001
Filing Date:
April 26, 1996
Export Citation:
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Assignee:
Ube Industries,Ltd.
International Classes:
B32B15/088; B32B15/08; C08L23/08; C08L29/04; C08L31/04; C08L77/00; C08L93/00; C08L93/04; C09D131/04; C09D177/00; C09D193/04; (IPC1-7): C09D177/00; B32B15/08; C08L31/04; C08L77/00; C08L93/04; C09D131/04; C09D193/04
Domestic Patent References:
JP54113629A
JP5053483A
JP57197142A



 
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