PURPOSE: To provide a semiconductor mounting device which enables surface mounting on both the surface and rear of a mounting board without any modification of product specifications.
CONSTITUTION: The semiconductor mounting device 100 has each lead 30 branched into a first frame lead portion 30A and a second branch lead portion 30B, and a first electrical contact portion 31 and a second electrical contact portion 32 are provided in the first and second branch lead portions 30A and 30B, respectively. For surface mounting on the surface 200a of a mounting board 200, the first electrical contact portion 31 is put in contact with a surface electrode portion 210. For surface mounting on the rear 200b, the second electrical contact portion 32 is put in contact with a rear electrode portion 220. In addition, the first and second electrical contact portions 31 and 32 may be provided in lead 30 by bending the lead 30 in the shape of a ring or making the lead into a multilayer lamination structure or three-dimensional structure, instead of forking the lead 30 into two branches.
MAEDA TOSHIO
NAKAMOTO TOSHIHIRO
MIYAZAWA KAZUYUKI
HITACHI DEVICE ENG