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Patent Searching and Data


Title:
TWO-LEVEL MOLD
Document Type and Number:
Japanese Patent JPS5634439
Kind Code:
A
Abstract:

PURPOSE: To form a two-level mold wherein the filling of each mold with resin is well balanced, by connecting a sprue to a divergent point toward the runner of each mold and thus equalizing the length of the route to each cavity.

CONSTITUTION: A sprue 9 is connected to a divergent point 25 of the runner 6 of the 1st-level mold 2 from the runner 7 of the 2nd level mold 4. By using the above two-level mold, a mold plate 14 on the movable side is moved to a mold plate 13 on the fixed side, thus the 1st-level mold 2 being fitted to the 2nd-level mold 4. Next, thermosetting resin is injected through the sprue 9 and the divergent point 25 and filled up in the 1st- and 2nd-level cavities 1 and 3 through the intermediary of the 1st- and 2nd-level runners 6 and 7, respectively. Then, the mold plate 14 on the movable side being separated from the mold plate 13 on the fixed side, the metal molds 2 and 4 are separated from each other and then the 1st- and 2nd-level knockout plates 22 and 24 are driven, thereby molded articles 16 and 17 obtained being taken out.


Inventors:
TAJIMA YUKIO
Application Number:
JP11202479A
Publication Date:
April 06, 1981
Filing Date:
August 31, 1979
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
H01L21/56; B29C41/00; B29C43/00; B29C45/00; B29C45/27; B29C45/32; B29C45/37; B29C45/38; B29C45/40; B29C45/73; (IPC1-7): B29F1/022; B29G3/00