To provide a wiring substrate for mounting a light emitting element where a sealing resin to be filled into a cavity is firmly adhered to the cavity in which a light emitting element is mounted, and which can efficiently reflect the light from the light emitting element.
The wiring substrate 1 for mounting a light emitting element includes a substrate body 2 which has a surface 3 and the back 4. The substrate 1 is composed of a ceramic (insulating material), a cavity 5 which is opened on the surface 3 of the substrate body 2 and where the light emitting element 8 is mounted on the bottom 7, a light reflecting layer 10 which is formed on the side 6 of the cavity 5, and pads (conductive layer) 11, 12 which are formed on the bottom 7 of the cavity 5. Between the edge of the light reflecting layer 10 on the bottom 7 of the cavity 5 and the bottom 7 of the cavity 5, there is a side surface (portion) r1 on which a ceramic of a ceramic layer z1 of a thickness (t) 0.05 mm to 0.2 mm is exposed.
WAKAKO HISASHI
UCHIDA ATSUSHI
MORITA MASAHITO
| JP2004111937A | 2004-04-08 | |||
| JP2003273405A | 2003-09-26 | |||
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| WO2004032571A2 | 2004-04-15 |