Title:
An adsorption device and a vacuum processor
Document Type and Number:
Japanese Patent JP6279149
Kind Code:
B2
Abstract:
The present invention provides a technology for reducing the attractive force of a chucking device at its surface contacting an object to be chucked to thereby eliminate or minimize the generation of dust when chucking and removing the object, and to enable control for making the attractive force of the chucking device uniform. The chucking device of the present invention includes: a main body portion 50 constituted by a dielectric and pairs of chucking electrodes 11 and 12 for attracting and holding a substrate 10, the pairs of chucking electrodes 11 and 12 being provided in the dielectric, each of the pairs of chucking electrodes 11 and 12 being opposite in polarity; and a plurality of conductive films 51 arranged on a part of the main body portion 50 on the chucking side relative to the pairs of chucking electrodes 11 and 12 in such a manner as to respectively span across a positive electrode 11a and a negative electrode 11b constituting the pair of chucking electrodes 11 and across a positive electrode 12a and a negative electrode 12b constituting the pair of chucking electrodes 12.
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Inventors:
Ken Maedaira
Fuwa Tillage
Tomohiro Hayasaka
Fuwa Tillage
Tomohiro Hayasaka
Application Number:
JP2017510190A
Publication Date:
February 14, 2018
Filing Date:
March 31, 2016
Export Citation:
Assignee:
ULVAC, Inc.
International Classes:
H01L21/683; H02N13/00
Domestic Patent References:
| JP2004022888A | ||||
| JP2008251737A | ||||
| JP2009302347A | ||||
| JP2012216774A |
Foreign References:
| WO2006049085A1 |
Attorney, Agent or Firm:
Hideki Abe
Shigeo Ishijima
Shigeo Ishijima
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