Title:
A constituent for injection molding, and a manufacturing method of a sintered compact
Document Type and Number:
Japanese Patent JP5970794
Kind Code:
B2
Abstract:
A composition for injection molding includes: an inorganic powder composed of at least one of a metal material and a ceramic material; and a binder containing a polyacetal-based resin, an unsaturated glycidyl group-containing polymer, and a lubricant. In the composition, the unsaturated glycidyl group-containing polymer is contained in an amount of 1% by mass or more and 30% by mass or less with respect to the amount of the polyacetal-based resin.
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Inventors:
Hama Nobuyuki Kura
Hidefumi Nakamura
Hidefumi Nakamura
Application Number:
JP2011262957A
Publication Date:
August 17, 2016
Filing Date:
November 30, 2011
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
B22F3/02; B22F1/102; B28B1/24; C04B35/00; C04B35/632; C08L59/00
Domestic Patent References:
| JP9111305A |
Foreign References:
| WO2010106949A1 |
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi
Kazuo Asahi