Title:
An electronic parts mounting device and an electronic component mounting method
Document Type and Number:
Japanese Patent JP6019410
Kind Code:
B2
Abstract:
Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads and a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.
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Inventors:
Hideaki Watanabe
Shigeki Imafuku
Toshiyuki Koyama
Shigeki Imafuku
Toshiyuki Koyama
Application Number:
JP2013234698A
Publication Date:
November 02, 2016
Filing Date:
November 13, 2013
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H05K13/04; H05K13/08
Domestic Patent References:
| JP58075014A | ||||
| JP44027533B1 |
Attorney, Agent or Firm:
Kenji Kamada
Hiroo Maeda
Hiroo Maeda
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