Title:
A processing method of a wafer
Document Type and Number:
Japanese Patent JP5946260
Kind Code:
B2
Abstract:
A wafer processing method for reducing the thickness of a wafer to a predetermined thickness, the wafer having a chamfered portion along the outer circumference thereof. The wafer processing method includes a stacked wafer forming step of attaching a support substrate to the front side of the wafer to thereby form a stacked wafer, and a chamfered portion removing step of positioning a cutting blade having a rotation axis parallel to the stacking direction of the stacked wafer formed by the stacked wafer forming step so that the outer circumference of the cutting blade faces the chamfered portion of the wafer, and then making the cutting blade cut into the wafer from the outer circumference toward the center thereof to thereby partially remove the chamfered portion in the range corresponding to the predetermined thickness from the front side of the wafer.
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Inventors:
Curl prewasser
Application Number:
JP2011244321A
Publication Date:
July 06, 2016
Filing Date:
November 08, 2011
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/304; B24B9/00
Domestic Patent References:
| JP2007508704A | ||||
| JP3183130A | ||||
| JP2010171955A |
Attorney, Agent or Firm:
Akira Matsumoto
Hiroshi Oue
Hiroshi Oue