Title:
半導体発光装置
Document Type and Number:
Japanese Patent JP7126314
Kind Code:
B2
Abstract:
To ensure impedance matching.SOLUTION: A semiconductor light emitting device has a mounting substrate 38 which has: a first transmission line 42 electrically connected to a first electrode 34; a second transmission line 44 electrically connected to a second electrode 36; and a ground layer 50. The first transmission line 42 has a width W1 orthogonal to a transmission direction. The first electrode 34 has a width W3 not exceeding the width W1 of the first transmission line 42 and faces the first transmission line 42. The ground layer 50 has a positional relationship with each part of the first transmission line 42 so as to be located adjacent to at least one side of a first side S1 in a direction along a thickness of the mounting substrate 38 and a second side S2 and a third side S3 across the first transmission line 42. The first transmission line 42 is joined to the first electrode 34 and has a uniform width W1 at least at a part which has the same positional relationship with respect to the ground layer 50 and where the ground layer 50 lies adjacent to each other along the transmission direction in a uniform shape.SELECTED DRAWING: Figure 1
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Inventors:
Hikaru Adachi
Application Number:
JP2018110058A
Publication Date:
August 26, 2022
Filing Date:
June 08, 2018
Export Citation:
Assignee:
Lumentum Japan Co., Ltd.
International Classes:
H01S5/02315; H01S5/026; H01S5/042
Domestic Patent References:
| JP2003177365A | ||||
| JP2014164243A | ||||
| JP2005286305A | ||||
| JP2001257435A | ||||
| JP2004039854A | ||||
| JP20179626A | ||||
| JP201711177A | ||||
| JP20173729A | ||||
| JP2016162962A | ||||
| JP2002277840A |
Foreign References:
| WO2007096939A1 | ||||
| WO2014104309A1 | ||||
| US20030218923 |
Attorney, Agent or Firm:
Patent Attorney Corporation Haruka International Patent Office