Title:
SEMICONDUCTOR MODULE
Document Type and Number:
Japanese Patent JP2023104012
Kind Code:
A
Abstract:
To provide a semiconductor module capable of reducing peeling of a mold agent from a substrate.SOLUTION: In a semiconductor module 1 in which a metal foil 200 is provided on one side 101 of a substrate 100, which is a heat dissipation side, and molded with a molding agent 300, the metal foil 200 includes an island portion 210 and an intermediate portion 220. The island portion 210 is formed by forming a plurality of island shapes on the edge portion 201 side of the metal foil 200. The intermediate portion 220 is formed by interposing the molding agent 300 between the adjacent island portions 210 and between the central portion 214 and the island portion 210 of the metal foil 200, and the substrate 100 and the molding agent 300 are joined in the intermediate portion 220.SELECTED DRAWING: Figure 1
Inventors:
NAKAGAWA MASAO
Application Number:
JP2022004740A
Publication Date:
July 28, 2023
Filing Date:
January 16, 2022
Export Citation:
Assignee:
SHINDENGEN ELECTRIC MFG
International Classes:
H01L25/07; H01L23/12; H01L23/13
Attorney, Agent or Firm:
Kaoru Kimura
Wataru Miyazawa
Wataru Miyazawa